Electronic device

ABSTRACT

An electronic device is disclosed, which includes: a first substrate having a display area comprising a biometric sensing region and a non-sensing region; a biometric sensing module disposed corresponding to the biometric sensing region; a light altering member at least partially formed in the biometric sensing region, wherein the light altering member comprises a reflecting layer and the reflecting layer comprises a plurality of openings; and a supporting film disposed under the first substrate and contacting the first substrate, wherein a reflectivity of the biometric sensing region is greater than a reflectivity of the non-sensing region, the supporting film comprises a hole, and the biometric sensing module disposed corresponding to the hole.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. Patentapplication for “Electronic device”, U.S. application Ser. No.16/046,088 filed Jul. 26, 2018, and the subject matter of which isincorporated herein by reference.

BACKGROUND 1. Field

The present disclosure relates to an electronic device. Moreparticularly, the present disclosure relates to an electronic devicewith a biometric sensing function.

2. Description of Related Art

With the continuous advancement of technologies related to electronicdevices, all the electronic devices are now developed towardcompactness, thinness, and lightness. For example, thin display devicesare the mainstream display devices on the market.

Nowadays, the electronic devices, for example, the display devices arerequired to have not only the display function but also other functionssuch as touch or identification functions. In addition, for the displaydevices to have higher display-to-body ratio, sensors of the displaydevices have to be embedded into display regions of the display devices.

When the sensors are integrated to the electronic devices, users have toinput a demand to turn on the electronic device to further access thesensing process. But, while at bright condition, it is difficult for theuser to see or know where the sensing region with the sensors disposedtherein is. Therefore, it is desired to provide an electronic devicethat the user could distinguish the sensing region from the non-sensingregion.

SUMMARY

The present disclosure provides an electronic device, which comprises: afirst substrate having a display area comprising a biometric sensingregion and a non-sensing region; a biometric sensing module disposedcorresponding to the biometric sensing region; a light altering memberat least partially formed in the biometric sensing region, wherein thelight altering member comprises a reflecting layer and the reflectinglayer comprises a plurality of openings; and a supporting film disposedunder the first substrate and contacting the first substrate, wherein areflectivity of the biometric sensing region is greater than areflectivity of the non-sensing region, the supporting film comprises ahole, and the biometric sensing module disposed corresponding to thehole.

Other novel features of the disclosure will become more apparent fromthe following detailed description when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of an electronic device according to one embodimentof the present disclosure.

FIG. 2 is a cross-sectional view of an electronic device according toEmbodiment 1 of the present disclosure.

FIG. 3 is a cross-sectional view of an electronic device according toEmbodiment 2 of the present disclosure.

FIG. 4 is a cross-sectional view of an electronic device according toEmbodiment 3 of the present disclosure.

FIG. 5 is a cross-sectional view of an electronic device according toEmbodiment 4 of the present disclosure.

FIG. 6 is a cross-sectional view of an electronic device according toEmbodiment 5 of the present disclosure.

FIG. 7A to FIG. 7F are cross-sectional views of light altering membersaccording to different aspects of the present disclosure.

FIG. 8A to FIG. 8C are cross-sectional views of electronic devicesaccording to different aspects of the present disclosure.

FIG. 9A to FIG. 9D are cross-sectional views of electronic devicesaccording to different aspects of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENT

The following embodiments when read with the accompanying drawings aremade to clearly exhibit the above-mentioned and other technicalcontents, features and/or effects of the present disclosure. Through theexposition by means of the specific embodiments, people would furtherunderstand the technical means and effects the present disclosure adoptsto achieve the above-indicated objectives. Moreover, as the contentsdisclosed herein should be readily understood and can be implemented bya person skilled in the art, all equivalent changes or modificationswhich do not depart from the concept of the present disclosure should beencompassed by the appended claims.

Furthermore, the ordinals recited in the specification and the claimssuch as “first”, “second” and so on are intended only to describe theelements claimed and imply or represent neither that the claimedelements have any proceeding ordinals, nor that sequence between oneclaimed element and another claimed element or between steps of amanufacturing method. The use of these ordinals is merely todifferentiate one claimed element having a certain designation fromanother claimed element having the same designation.

Furthermore, the terms recited in the specification and the claims suchas “above”, “over”, or “on” are intended not only directly contact withthe other element, but also intended indirectly contact with the otherelement. Similarly, the terms recited in the specification and theclaims such as “below”, or “under” are intended not only directlycontact with the other element but also intended indirectly contact withthe other element.

Furthermore, the terms recited in the specification and the claims suchas “connect” is intended not only directly connect with other element,but also intended indirectly connect and electrically connect with otherelement.

Furthermore, when a value is in a range from a first value to a secondvalue, the value can be the first value, the second value, or anothervalue between the first value and the second value.

In addition, the features in different embodiments of the presentdisclosure can be mixed to form another embodiment.

FIG. 1 is a top view of an electronic device according to one embodimentof the present disclosure. The electronic device comprises: a displayarea AA comprising a biometric sensing region S and a non-sensing regionNS; and a border area B. The border area B is adjacent to the displayarea AA, and the biometric sensing region S is adjacent to thenon-sensing region NS. In one embodiment, the biometric sensing region Sis enclosed by the non-sensing region NS. Hence, the electronic deviceof the present embodiment can perform not only the display function butalso the sensing function. Herein, the biometric sensing region S is aregion disposed with at least one sensing unit. Examples of the sensingunit capable of using in the electronic device of the present embodimentmay comprise a fingerprint sensor, an iris sensor, a retina sensor, afacial sensor, a vein sensor, a voice sensor, a motion sensor, a gesturesensor or a DNA sensor, but the present disclosure is not limitedthereto.

In the present embodiment, the biometric sensing region S has smallersurface area than the non-sensing region NS. In one aspect of thepresent disclosure, the surface area of the biometric sensing region Scould be larger than 250,000 μm² (i.e. 500 μm×500 μm), but the presentdisclosure is not limited thereto. In another aspect of the presentdisclosure, the surface area of the biometric sensing region S could beequal to or smaller than the surface area of the display area AA, forexample, the surface area of the biometric sensing region S is a thirdof the surface area of the display area AA or less, but the presentdisclosure is not limited thereto. In one embodiment, if the surfacearea of the biometric sensing region S equals to the surface area of thedisplay area AA, different reflectivity might still be found indifferent regions in the display area AA in accordance with design ofsensing units. The surface area of the biometric sensing region S can beadjusted according to the user's requirement, as long as the biometricsensing region S locates within the display area AA. In the presentembodiment, the surface area of the biometric sensing region S could becalculated by measuring an area of a region projected on a substrate.For example, the surface area of the biometric sensing region S is anarea of a projection of the biometric sensing region S on a substrate(e.g. a first substrate 11 in FIG. 2).

When the sensors are integrated to the electronic devices, users have toinput a demand to turn on the electronic device to further access thesensing process. Sometimes it may be difficult for the user to see orknow where the biometric sensing region S is (for example, under thesun). In the present embodiment, a reflectivity of the biometric sensingregion S is designed to be different from a reflectivity of thenon-sensing region NS to help the users to distinguish the biometricsensing region S from the non-sensing region NS.

In one aspect of the present disclosure, the reflectivity of thebiometric sensing region S is greater than the reflectivity of thenon-sensing region NS.

Hereinafter, several embodiments are provided to show how to design thereflectivity of the biometric sensing region S different from thereflectivity of the non-sensing region NS, but the present disclosure isnot limited to the following embodiments.

Embodiment 1

FIG. 2 is a cross-sectional view of an electronic device along a lineI-I′ in FIG. 1 according to the present embodiment.

As shown in FIG. 1 and FIG. 2, the electronic device of the presentembodiment comprises: a first substrate 11; and a display layer 13disposed on the first substrate 11, wherein the display layer 13comprises a first display region 131 and a second display region 132,the first display region 131 corresponds to the non-sensing region NS,and the second display region 132 corresponds to the biometric sensingregion S. In addition, the electronic device of the present embodimentfurther comprises: a cover substrate 12 disposed on the display layer13.

Even not shown in the figure, the display layer 13 may comprisestransistors, conductive lines, conductive pads, and/or any otherelement. The first substrate 11 and the cover substrate 12 canrespectively be a quartz substrate, a glass substrate, a wafer, asapphire substrate, or any other suitable substrate. The first substrate11 and the cover substrate 12 can also be a flexible substrate or a filmrespectively, and the material of which can comprise polycarbonate (PC),polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), orother plastic material. In another embodiment of the present disclosure,the cover substrate 12 can be replaced by an encapsulating layer, apolarizer or other suitable film.

Even not shown in the figure, the electronic device of the presentembodiment may further comprise a display medium layer disposed betweenthe display layer 13 and the cover substrate 12. The display mediumlayer may comprise liquid crystals (LCs), quantum dots (QDs),fluorescence molecules, phosphors, organic light-emitting diodes(OLEDs), inorganic light-emitting diodes (LEDs), mini light-emittingdiodes (mini-LEDs), micro light-emitting diodes (micro-LEDs), orquantum-dot light-emitting diodes (QLEDs). It could be understood thatthe chip size of the LED can be 300 μm to 10 mm, the chip size of themini-LED can be 100 μm to 300 μm, and the chip size of the micro-LED canbe 1 μm to 100 μm. But the present disclosure is not limited thereto. Inone embodiment of the present disclosure, if the display medium layercomprises LCs, the border area B in the cross-sectional view maycomprise sealant or any other suitable elements. In another embodimentof the present disclosure, if the display medium layer comprises OLEDs,the border area B in the cross-sectional view may compriseorganic-inorganic layers of dam or any other suitable elements. In theembodiment of the present disclosure, if the display medium layercomprises LEDs, mini-LEDs or micro-LEDs, the border area B in thecross-sectional view may comprise multiple layers of inorganic ororganic material, patterned glass frit, sealant or any other suitableelements, but the present disclosure is not limited thereto.

In the present embodiment, a biometric sensing module 2 is disposedunder the first substrate 11 and corresponds to the biometric sensingregion S and the second display region 132. The biometric sensing module2 may comprises an optical sensing unit 21, a sensing layer 22 and asensing circuit layer 23, wherein the sensing layer 22 is disposedbetween the optical sensing unit 21 and the sensing circuit layer 23,and the sensing layer 22 is electrically connected to the sensingcircuit layer 23. The optical sensing unit 21 could be PN diode capableof detecting light signal, while the sensing layer 22 could be thelayers used to make the thin film transistor or any other transistorcapable of controlling the PN diode. The sensing circuit layer 23 couldcomprise a circuit IC. For example, the sensing circuit layer 23 couldbe circuits or IC formed on a substrate (e.g. the material used for thefirst substrate 11 as mentioned above, like glass, polyimide, PET,silicon, etc), or the sensing circuit layer 23 could be electricallyconnected to IC through a printed circuit board (PCB) or a flexibleprinted circuit board (FPC). But, the present disclosure is not limitedthereto. In another embodiment of the present disclosure, the sensinglayer 22 may be disposed on the first substrate 11 and formed togetherwith the display layer 13 (or the display medium layer), and the sensingcircuit layer 23 is disposed under the first substrate 11 andelectrically connected with the sensing layer 22. In further anotherembodiment of the present disclosure, the sensing circuit layer 23 isdisposed under the first substrate 11, a part of the sensing layer 22may be disposed on the first substrate 11 and formed together with thedisplay layer 13 (or the display medium layer), and a part of thesensing layer 22 may be disposed between the first substrate 11 and thesensing circuit layer 23. In one embodiment, the sensing layer 22 may beformed together with the display layer 13. However, the presentdisclosure is not limited thereto.

In the present embodiment, a reflectivity of the first display region131 is different from a reflectivity of the second display region 132.In one aspect of the present embodiment, the reflectivity of the firstdisplay region 131 is less than the reflectivity of the second displayregion 132.

In one embodiment, to accomplish the purpose of the reflectivitydifference between the first display region 131 and the second displayregion 132, the density of the conductive lines in the first displayregion 131 can be different from the density of the conductive lines inthe second display region 132, or the density of the conductive pads inthe first display region 131 can be different from the density of theconductive pads in the second display region 132. However, the manner toaccomplish the reflectivity difference between the first display region131 and the second display region 132 is not limited to those statedabove.

In the present embodiment, because there is a reflectivity differencebetween the first display region 131 and the second display region 132,it could help the users to distinguish the biometric sensing region Scorresponding to the second display region 132 from the non-sensingregion NS corresponding to the first display region 131.

Embodiment 2

FIG. 3 is a cross-sectional view of an electronic device along a lineI-I′ in FIG. 1 according to the present embodiment. The electronicdevice of the present embodiment is similar to the electronic device ofEmbodiment 1, except for the following differences.

In the present embodiment, the display layer 13 does not comprise thefirst display region 131 and the second display region 132 as shown inFIG. 2. In addition, the sensing layer 22 shown in FIG. 2 is integratedwith a touch sensing layer 14 in the present embodiment.

As shown in FIG. 1 and FIG. 3, the electronic device of the presentembodiment further comprises: a touch sensing layer 14 disposed on thefirst substrate 11, wherein the touch sensing layer 14 comprises a firsttouch sensing region 141 and a second touch sensing region 142, thefirst touch sensing region 141 corresponds to the non-sensing region NS,the second touch sensing region 142 corresponds to the biometric sensingregion S, and a reflectivity of the first touch sensing region 141 isdifferent from a reflectivity of the second touch sensing region 142.Herein, at least one touch unit (not shown in the figure) is disposed inthe first touch sensing region 141, and at least one sensing unit (notshown in the figure) is disposed in the second touch sensing region 142.Herein, the at least one sensing unit could have both sensing functionand touch function, but the present disclosure is not limited thereto.The sensing function and touch function of the at least one sensing unitcould be driven or controlled by a controller, (e.g. ICs, etc) so as theat least one sensing unit could detect biometric data at one particularperiod, while at the other particular period of time, the at least onesensing unit could detect touch data.

Herein, the touch sensing layer 14 is disposed on the display layer 13,so the electronic device of the present embodiment is an in-cell touchelectronic device. In another embodiment of the present disclosure, theelectronic device may further comprise a display medium layer disposedon the display layer 13, and the touch sensing layer 14 is disposedbetween the display medium layer and the cover substrate 12; so theelectronic device is an on-cell touch electronic device. In furtheranother embodiment of the present disclosure, the touch sensing layer 14can be disposed outside the cover substrate 12, so the electronic deviceis an out-cell touch electronic device.

In the present embodiment, a reflectivity of the first touch sensingregion 141 is different from a reflectivity of the second touch sensingregion 142. In one aspect of the present embodiment, the reflectivity ofthe first touch sensing region 141 is less than the reflectivity of thesecond touch sensing region 142.

Herein, various manners can be used to make the reflectivity differencesbetween the first touch sensing region 141 and the second touch sensingregion 142. For example, the density of the conductive lines in thefirst touch sensing region 141 can be different from the density of theconductive lines in second touch sensing region 142, the materialcomprised in the conductive lines in the first touch sensing region 141can be different from the material comprised in the conductive lines inthe second touch sensing region 142, or the density or the material ofthe touch units in the first touch sensing region 141 can be differentfrom the density or the material of the touch units or the sensing unitsin the second touch sensing region 142. However, the present disclosureis not limited thereto.

In the present embodiment, because there is a reflectivity differencebetween the first touch sensing region 141 and the second touch sensingregion 142, it could help the users to distinguish the biometric sensingregion S corresponding to the second touch sensing region 142 from thenon-sensing region NS corresponding to the first touch sensing region141.

Embodiment 3

FIG. 4 is a cross-sectional view of an electronic device along a lineI-I′ in FIG. 1 according to the present embodiment. The electronicdevice of the present embodiment is similar to the electronic device ofEmbodiment 1, except for the following differences.

In the present embodiment, the display layer 13 does not comprise thefirst display region 131 and the second display region 132 as shown inFIG. 2.

As shown in FIG. 1 and FIG. 4, the electronic device of the presentembodiment comprises: a first substrate 11; a second substrate 15opposite to the first substrate 11; and a color filter layer 17 disposedbetween the first substrate 11 and the second substrate 15, wherein thecolor filter layer 17 comprises a first region 171 and a second region172, the first region 171 corresponds to the non-sensing region NS, thesecond region 172 corresponds to the biometric sensing region S, and areflectivity of the first region 171 is different from a reflectivity ofthe second region 172. In addition, the electronic device of the presentembodiment further comprise a display medium layer 16 disposed betweenthe display layer 13 and the color filter layer 17. The features of thedisplay medium layer 16 are illustrated above, and are not repeatedagain. In addition, the material used for the first substrate 11 canalso be used in the second substrate 15, and is not repeated again.

In the present embodiment, a reflectivity of the first region 171 isdifferent from a reflectivity of the second region 172. In one aspect ofthe present embodiment, the reflectivity of the first region 171 is lessthan the reflectivity of the second region 172.

In the present embodiment, the material for the first region 171 of thecolor filter layer 17 may comprise resin, and the material for thesecond region 172 of the color filter layer 17 may comprise quantumdots. Because the material for the second region 172 is different fromthe material for the first region 171, there is a reflectivitydifference between the first region 171 and the second region 172, andit could help the users to distinguish the biometric sensing region Scorresponding to the second region 172 from the non-sensing region NScorresponding to the first region 171.

Embodiment 4

FIG. 5 is a cross-sectional view of an electronic device along a lineI-I′ in FIG. 1 according to the present embodiment. The electronicdevice of the present embodiment is similar to the electronic device ofEmbodiment 1, except for the following differences.

In the present embodiment, the display layer 13 does not comprise thefirst display region 131 and the second display region 132 as shown inFIG. 2.

As shown in FIG. 1 and FIG. 5, the electronic device of the presentembodiment comprises a biometric sensing module 2 corresponding to thebiometric sensing region S, wherein the biometric sensing module 2 canbe an optical sensor module which comprises an optical sensing unit 21,a sensing layer 22, and a sensing circuit layer 23, wherein the sensinglayer 22 is disposed between the optical sensing unit 21 and the sensingcircuit layer 23, and the sensing layer 22 is electrically connectedwith the sensing circuit layer 23.

In the present embodiment, by disposing the biometric sensing module 2corresponding to the biometric sensing region S, a reflectivity of thebiometric sensing region S is different from a reflectivity of thenon-sensing region NS.

In one aspect of the present embodiment, the reflectivity of thebiometric sensing region S is greater than the reflectivity of thenon-sensing region NS. When incident light irradiates into theelectronic device of the present embodiment, a part of the incidentlight is reflected, and a part of the incident light is penetratedthrough the electronic device. In the biometric sensing region S, theincident light may further penetrate through the optical sensing unit 21and reach to the sensing layer 22. Because the reflectivity of thebiometric sensing region S is greater than the reflectivity of thenon-sensing region NS due to the disposition of the biometric sensingmodule 2, an intensity of the reflected light in the biometric sensingregion S is greater than an intensity of the reflected light in thenon-sensing region NS, so it could help the users to distinguish thebiometric sensing region S from the non-sensing region NS.

Embodiment 5

FIG. 6 is a cross-sectional view of an electronic device along a lineI-I′ in FIG. 1 according to the present embodiment. The electronicdevice of the present embodiment is similar to the electronic device ofEmbodiment 4, except for the following differences.

In the present embodiment, the electronic further comprises: a lightaltering member 3 at least partially formed in the biometric sensingregion S. Herein, the light altering member 3 is disposed between thefirst substrate 11 and the biometric sensing module 2.

Herein, the light altering member 3 is a member capable of altering thephysical properties of the incident light, e.g. altering the intensityof the incident light in different wavelengths, changing the directionof the incident angle of the incident light, or reflecting the incidentlight with particular wavelengths, etc.

Hereinafter, several examples for the light altering member 3 areillustrated, but the present disclosure is not limited thereto.

FIG. 7A is a cross-sectional view of a light altering member in oneaspect of the present disclosure. The light altering member 3 comprisesa plurality of openings 331. More specifically, the light alteringmember 3 comprises a first insulating layer 31, a second insulatinglayer 32 and a reflecting layer 33, the reflecting layer 33 is disposedbetween the first insulating layer 31 and the second insulating layer32, and the reflecting layer 33 comprise the plurality of openings 331.By using the light altering member 3 with the openings 331, only a partof the incident light can reach to the biometric sensing module 2 (asshown in FIG. 6). Thus, noise from the incident light can be reduced toincrease the sensing performance or resolution of the biometric sensingmodule 2. Herein, the first insulating layer 31 and the secondinsulating layer 32 may respectively comprise silicon oxide, siliconoxynitride, silicon nitride, aluminum oxide, resin, polymer,photoresist, or a combination thereof, but the present disclosure is notlimited thereto. The reflecting layer 33 may comprise metal such as Ag,Al, or alloy thereof, but the present disclosure is not limited thereto.

FIG. 7B is a cross-sectional view of a light altering member in anotheraspect of the present disclosure. The light altering member 3 comprisesa first insulating layer 31 and a micro-structure layer 35 disposed onthe first insulating layer 31, wherein the micro-structure layer 35comprises a micro structure with reflective properties. By using thelight altering member 3 with the micro structure, noise (e.g. incidentlight with large angle of incidence, etc) can be reduced to increase thesensing performance or resolution of the biometric sensing module 2. Itshould be noted that the micro structure of the micro-structure layer 35is not limited to that shown in FIG. 7B, and the shape of the microstructure can be adjusted according to the need. The micro-structurelayer 35 may be a prism layer or a lens layer, but the presentdisclosure is not limited thereto.

FIG. 7C is a cross-sectional view of a light altering member in anotheraspect of the present disclosure. The light altering member 3 maycomprise a first low refractive layer 361, wherein the first lowrefractive layer 361 comprises a material with a refractive index lowerthan the first substrate 11. FIG. 7D is a cross-sectional view of alight altering member in another aspect of the present disclosure. Thelight altering member 3 comprises a first low refractive layer 361 and asecond low refractive layer 362 disposed on the first low refractivelayer 361, wherein the first low refractive layer 361 and the second lowrefractive layer 362 respectively comprise a material with a refractiveindex lower than the first substrate 11, and the refractive index of thematerial comprised in the first low refractive layer 361 is differentfrom the refractive index of the material comprised in the second lowrefractive layer 362.

For example, if the first substrate 11 has a refractive index of 1.5,the first low refractive layer 361 and the second low refractive layer362 may respectively comprise a material with a refractive index lowerthan 1.5. In one embodiment of the present disclosure, the refractiveindex difference between the first low refractive layer 361 and thefirst substrate 11 can be ranged from 0.09 to 0.2, the refractive indexdifference between the second low refractive layer 362 and the firstsubstrate 11 can be ranged from 0.09 to 0.2, so the first low refractivelayer 361 and the second low refractive layer 362 may comprise amaterial with a refractive index ranged from 1.30 to 1.41. In anotherembodiment of the present disclosure, the refractive index differencebetween the first low refractive layer 361 and the first substrate 11can be ranged from 0.09 to 0.18, the refractive index difference betweenthe second low refractive layer 362 and the first substrate 11 can beranged from 0.09 to 0.18, so the first low refractive layer 361 and thesecond low refractive layer 362 may comprise a material with arefractive index ranged from 1.32 to 1.41. However, the presentdisclosure is not limited thereto.

It should be noted that, FIG. 7C and FIG. 7D show the aspects that thelight altering member 3 comprises one or two low refractive layers, butthe present disclosure is not limited thereto. In other embodiments ofthe present disclosure, the light altering member 3 may comprise two ormore low refractive layers as long as the two or more low refractivelayers comprise a material with a refractive index lower than the firstsubstrate 11.

In the present disclosure, the reflectivity of the biometric sensingregion S is different from the non-sensing region NS. In one embodiment,the reflectivity of the biometric sensing region S could be less thanthe non-sensing region NS by using the light altering member 3 withsuitable material or structure. But, the present disclosure is notlimited thereto.

FIG. 7E is a cross-sectional view of a light altering member in anotheraspect of the present disclosure. The light altering member 3 maycomprise a wavelength converting film 37. The wavelength converting film37 can filter the light with undesired wavelength and let the light withdesired wavelength penetrate through the wavelength converting film 37to reach to the biometric sensing module 2 (as shown in FIG. 6). In oneembodiment of the present disclosure, the wavelength converting film 37may further convert the light with undesired wavelength into the lightwith desired wavelength, and the converted light may penetrate throughthe wavelength converting film 37 to reach to the biometric sensingmodule 2 (as shown in FIG. 6). Thus, the sensing performance orresolution of the biometric sensing module 2 can further be improved.Examples of the wavelength converting film 37 may comprise a colorfilter film, a quantum dot film or a resin film, but the presentdisclosure is not limited thereto.

FIG. 7F is a cross-sectional view of a light altering member in anotheraspect of the present disclosure. The light altering member 3 mayfurther comprises a reflecting layer 38 disposed under the wavelengthconverting film 37, and the reflecting layer 38 comprises a plurality ofopenings 381. By using the reflecting layer 38 with the openings 381,only a part of the incident light can reach to the biometric sensingmodule 2 (as shown in FIG. 6). Thus, noise from the incident light canbe reduced to increase the sensing performance or resolution of thebiometric sensing module 2. In another embodiment of the presentdisclosure, the material of the wavelength converting film 37 may alsofill into the openings 381 of the reflecting layer 38.

In Embodiment 5 of the present disclosure, the light altering member 3is disposed between the first substrate 11 and the biometric sensingmodule 2, as shown in FIG. 6. However, the present disclosure is notlimited thereto and the light altering member 3 can be disposed indifferent positions of the electronic device, as long as the lightaltering member 3 corresponds to the biometric sensing module 2 in thebiometric sensing region S.

FIG. 8A to FIG. 8C are cross-sectional views of electronic devicesaccording to different aspects of the present disclosure. As shown inFIG. 8A, the light altering member 3 is disposed on the display layer13, and the light altering member 3 is disposed between the displaylayer 13 and the cover substrate 12. As shown in FIG. 8B, the lightaltering member 3 is disposed between the first substrate 11 and thedisplay layer 13. As shown in FIG. 8C, the light altering member 3 isdisposed between the first substrate 11 and the touch sensing layer 14,or the light altering member 3 is disposed between the display layer 13and the touch sensing layer 14. As shown in FIG. 8A to FIG. 8C, thelight altering member 3 is at least partially formed in the biometricsensing region S, and more specifically, the light altering member 3corresponds to the biometric sensing module 2 in the biometric sensingregion S.

Herein, the light altering members 3 shown in FIG. 7A to FIG. 7F can beused in the electronic devices shown in FIG. 8A to FIG. 8C.

FIG. 9A to FIG. 9D are cross-sectional views of electronic devicesaccording to different aspects of the present disclosure. As shown inFIG. 9A, the electronic device may further comprise a supporting film 18disposed under the first substrate 11 and having a hole 181, wherein thebiometric sensing module 2 is disposed under the first substrate 11 andcorresponds to the hole 181. Because the material of the supporting film18 usually has poor transmittance, the hole 181 in the supporting film18 is required for the biometric sensing module 2. In addition, thereflectivity of the biometric sensing region S is different from thereflectivity of the non-sensing region NS (as shown in FIG. 1) due tothe formation of the hole 181. Furthermore, the transmittance of theelectronic device in the biometric sensing region S is different fromthe transmittance of the electronic device in the non-sensing region NS(as shown in FIG. 1) due to the formation of the hole 181. As shown inFIG. 9B, the electronic device may further comprise an adhesive layer182 forming on a sidewall of the hole 181, and the adhesive layer 182could increase the adhesion of the biometric sensing module 2 on thesupporting film 18. As shown in FIG. 9C, the first substrate 11 may alsohave a hole 111 corresponding to the hole 181. Because the thickness ofthe first substrate 11 corresponding to the biometric sensing module 2is reduced by forming the hole 111, the intensity of the light reachingthe biometric sensing module 2 could be increased. In addition, as shownin FIG. 9D, the biometric sensing module 2 may be disposed into the hole181 and the hole 111, shortening the path required for the light toreach the sensing module 2.

In any of the electronic devices illustrated above, the electronicdevice could be further designed or configured to display an icon tohint or emphasize where the biometric sensing region is. The icon couldoverlap with the biometric sensing region but could have different sizeand different shape with the biometric sensing region.

Hereinafter, the method to identify the biometric sensing region and thenon-sensing region of the electronic device is exemplified.

The reflectivity of the electronic device is measured using aspectrophotometer. As shown in FIG. 1, the reflectivity of one point (Mpoint) in the non-sensing region NS and one point (N point) in thebiometric sensing region S is measured. The spectrophotometer could bedirectly placed on and come into contact with the surface of the screenwithin the display area of an intact mobile phone (without destructionor disassembling) to measure the reflectivity. The reflectivity data ateach point could be measure one time or more than one time. Thereflectivity of the screen could also be measured at more than one angle(e.g. the mobile phone is placed on the table and rotated 90 degreesclockwise, and the reflectivity is measured; that is, the screen of themobile phone is measured at different angles to obtain itsreflectivity). If the measurement angle is more than one or if themeasurement number is more than one, the average of the measuredreflectivity should be considered. The reflectivity of different pointsis then measured and compared. If the reflectivity difference betweentwo points is more than 4%, the reflectivity between two points could beconsidered to have significant difference. That is, if the reflectivitydifference between two points is more than 4%, two points could beconsidered to locate in different region (e.g. one point is located inthe biometric sensing region S and the other one is located in thenon-sensing region NS). However, the present disclosure is not limitedto this measurement method, and other suitable methods to measure thereflectivity could be used.

In the present disclosure, at least two electronic devices can bearranged in juxtaposition to form a tiled electronic device. The atleast two electronic devices can be the same or different, which can beselected from the electronic device made as described in any of theembodiments of the present disclosure as described previously.

The display panel and the display device made as described in any of theembodiments of the present disclosure as described previously can beco-used with a touch panel to form a touch display device. Meanwhile, adisplay device or touch display device may be applied to any electronicdevices known in the art that need a display screen, such as displays,mobile phones, laptops, video cameras, still cameras, music players,mobile navigators, TV sets, and other electronic devices that displayimages.

Although the present disclosure has been explained in relation to itsembodiment, it is to be understood that many other possiblemodifications and variations can be made without departing from thespirit and scope of the disclosure as hereinafter claimed.

What is claimed is:
 1. An electronic device, comprising: a firstsubstrate having a display area comprising a biometric sensing regionand a non-sensing region; a biometric sensing module disposedcorresponding to the biometric sensing region; a light altering memberat least partially formed in the biometric sensing region, wherein thelight altering member comprises a reflecting layer and the reflectinglayer comprises a plurality of openings; and a supporting film disposedunder the first substrate and contacting the first substrate, wherein areflectivity of the biometric sensing region is greater than areflectivity of the non-sensing region, the supporting film comprises ahole, and the biometric sensing module disposed corresponding to thehole.
 2. The electronic device of claim 1, wherein the biometric sensingregion is enclosed by the non-sensing region.
 3. The electronic deviceof claim 1, wherein the biometric sensing region has smaller surfacearea than the non-sensing region.
 4. The electronic device of claim 1,further comprising: a display layer disposed on the first substrate,wherein the display layer comprises a first display region and a seconddisplay region, the first display region corresponds to the non-sensingregion, the second display region corresponds to the biometric sensingregion, and a reflectivity of the first display region is different froma reflectivity of the second display region.
 5. The electronic device ofclaim 1, further comprising: a touch sensing layer disposed on the firstsubstrate, wherein the touch sensing layer comprises a first touchsensing region and a second touch sensing region, the first touchsensing region corresponds to the non-sensing region, the second touchsensing region corresponds to the biometric sensing region, and areflectivity of the first touch sensing region is different from areflectivity of the second touch sensing region.
 6. The electronicdevice of claim 1, further comprising: a second substrate opposite tothe first substrate; and a color filter layer disposed between the firstsubstrate and the second substrate, wherein the color filter layercomprises a first region and a second region, the first regioncorresponds to the non-sensing region, the second region corresponds tothe biometric sensing region, and a reflectivity of the first region isdifferent from a reflectivity of the second region.
 7. The electronicdevice of claim 1, wherein the light altering member comprises a firstinsulating layer and a second insulating layer, and the reflecting layeris disposed between the first insulating layer and the second insulatinglayer.
 8. The electronic device of claim 1, wherein the light alteringmember comprises a first insulating layer and a micro-structure layerdisposed on the first insulating layer.
 9. The electronic device ofclaim 1, wherein the light altering member comprises a material with arefractive index lower than 1.5.
 10. The electronic device of claim 1,wherein the light altering member comprises a first low refractive layerand a second low refractive layer disposed on the first low refractivelayer, the first low refractive layer and the second low refractivelayer respectively comprises a material with a refractive index lowerthan 1.5, and the refractive index of the material comprised in thefirst low refractive layer is different from the refractive index of thematerial comprised in the second low refractive layer.
 11. Theelectronic device of claim 1, wherein the light altering membercomprises a wavelength converting film.
 12. The electronic device ofclaim 11, wherein the reflecting layer is disposed under the wavelengthconverting film.
 13. The electronic device of claim 4, wherein the lightaltering member is disposed on the display layer.
 14. The electronicdevice of claim 4, wherein the light altering member is disposed betweenthe first substrate and the display layer.
 15. The electronic device ofclaim 5, wherein the light altering member is disposed between the firstsubstrate and the touch sensing layer.
 16. The electronic device ofclaim 1, wherein the biometric sensing module is disposed under thefirst substrate.
 17. The electronic device of claim 1, wherein amaterial of the reflecting layer comprises a metal.